JPS6079770U - 積層型ハイブリツドｉｃ - Google Patents

積層型ハイブリツドｉｃ

Info

Publication number
JPS6079770U
JPS6079770U JP17250183U JP17250183U JPS6079770U JP S6079770 U JPS6079770 U JP S6079770U JP 17250183 U JP17250183 U JP 17250183U JP 17250183 U JP17250183 U JP 17250183U JP S6079770 U JPS6079770 U JP S6079770U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
hole
conductive pattern
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17250183U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0220861Y2 (en]
Inventor
福与　良二
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP17250183U priority Critical patent/JPS6079770U/ja
Publication of JPS6079770U publication Critical patent/JPS6079770U/ja
Application granted granted Critical
Publication of JPH0220861Y2 publication Critical patent/JPH0220861Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP17250183U 1983-11-07 1983-11-07 積層型ハイブリツドｉｃ Granted JPS6079770U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17250183U JPS6079770U (ja) 1983-11-07 1983-11-07 積層型ハイブリツドｉｃ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17250183U JPS6079770U (ja) 1983-11-07 1983-11-07 積層型ハイブリツドｉｃ

Publications (2)

Publication Number Publication Date
JPS6079770U true JPS6079770U (ja) 1985-06-03
JPH0220861Y2 JPH0220861Y2 (en]) 1990-06-06

Family

ID=30376007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17250183U Granted JPS6079770U (ja) 1983-11-07 1983-11-07 積層型ハイブリツドｉｃ

Country Status (1)

Country Link
JP (1) JPS6079770U (en])

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057275A (ja) * 2000-08-10 2002-02-22 Ibiden Co Ltd 半導体モジュールの製造方法
JP2002057277A (ja) * 2000-08-10 2002-02-22 Ibiden Co Ltd 半導体モジュールの製造方法
JP2002057276A (ja) * 2000-08-10 2002-02-22 Ibiden Co Ltd 半導体モジュールの製造方法
JP2002064178A (ja) * 2000-08-18 2002-02-28 Ibiden Co Ltd 半導体モジュールの製造方法
US8034658B2 (en) 2003-04-01 2011-10-11 Imbera Electronics Oy Electronic module with a conductive-pattern layer and a method of manufacturing same
US8704359B2 (en) 2003-04-01 2014-04-22 Ge Embedded Electronics Oy Method for manufacturing an electronic module and an electronic module
JP2018180347A (ja) * 2017-04-15 2018-11-15 株式会社サムス 電子部品モジュール装置及びその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057275A (ja) * 2000-08-10 2002-02-22 Ibiden Co Ltd 半導体モジュールの製造方法
JP2002057277A (ja) * 2000-08-10 2002-02-22 Ibiden Co Ltd 半導体モジュールの製造方法
JP2002057276A (ja) * 2000-08-10 2002-02-22 Ibiden Co Ltd 半導体モジュールの製造方法
JP2002064178A (ja) * 2000-08-18 2002-02-28 Ibiden Co Ltd 半導体モジュールの製造方法
US8034658B2 (en) 2003-04-01 2011-10-11 Imbera Electronics Oy Electronic module with a conductive-pattern layer and a method of manufacturing same
US8704359B2 (en) 2003-04-01 2014-04-22 Ge Embedded Electronics Oy Method for manufacturing an electronic module and an electronic module
US9363898B2 (en) 2003-04-01 2016-06-07 Ge Embedded Electronics Oy Method for manufacturing an electronic module and an electronic module
JP2018180347A (ja) * 2017-04-15 2018-11-15 株式会社サムス 電子部品モジュール装置及びその製造方法

Also Published As

Publication number Publication date
JPH0220861Y2 (en]) 1990-06-06

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